Its a no-clean solder paste, developed for fine pitch printing. Applied by squeegees or closed head, the deposit has a very sharp definition even after several hours abandon time on stencil. Their rheological properties are suitable for “pin in paste” process. Ecorel Easy 803S is combining Sn63Pb37 alloy with the reliable chemistry of the Ecorel range.
Lead containing alloys are perfect to withstand constant high temperature fluctuations (-40 to >130 Celcius). However, leaded solder pasted are limited in their use due to the environmental impact of lead. Exceptions are made for Automotive, Aerospace and Defence electronics. Inventec can help you to propose a lead free alternative based on your specific application.
Alloy | Sn62Pb36Ag2 |
Melting Point (ºC) | 183 |
Melting Content (%) | 89.5 |
Post Reflow Residue (%) | 57 - 64 |
Halogen Content (%) | No Halogen |
Power Size (μm) | 25 -45 (Type 3) |
Flux Classification | ROL0, 113 (ISO 9454) |
Solder Balling Test | Pass - ANSI/ J-STA-005 |
Copper Mirror | Pass - ANSI/ J-STA-004 |
Copper Corrosion | Pass - ANSI/ J-STA-004 |
SIR (IPC) | Pass - ANSI/ J-STA-004 |
SIR (Bellcore) | Pass - Bellcore |
Electromigration (IPC/ Bellcore) | Pass - ANSI/J-STD-004/ Bellcore |
Bono Corrosion Test | Pass, FC = 1,4%; Inventec procedure |