ECOREL FREE 387-28 is especially designed for high volume & complex boards assembly. The paste has a very good pin-in-paste performance within a large process window to achieve flawless, reproducible & stable operation. Furthermore, it shows ideal performance when soldering medium to large boards.
ECOREL FREE 387-28 formulation is also available in other alloys and particle sizes upon request.
FEATURES:
- SAC387 lead free solder paste
- No clean SMT printing process
- Robust assembly process
Alloy | Sn95,5Ag3,8Cu0,7 |
Melting Point (ºC) | 217/ 422 |
Melting Content (%) | 88.5 |
Post Reflow Residue (%) | approximately 5% by w/w |
Halogen Content (%) | |
Power Size (μm) | 20 – 38 |
Flux Classification | ROL0, 113 (ISO 9454) |
Solder Balling Test | Pass - ANSI/ J-STA-004 |
Copper Mirror | Pass - ANSI/ J-STA-004 |
Copper Corrosion | Pass - ANSI/ J-STA-004 |
SIR (IPC) | Pass - ANSI/ J-STA-004 |
SIR (Bellcore) | Pass - Bellcore |
Electromigration (IPC/ Bellcore) | Pass - ANSI/J-STD-004/ Bellcore |
Bono Corrosion Test | Pass, FC = 1,4%; Inventec procedure |