The ECORELTM FREE 305-21 solder paste is designed to provide excellent wettability on various lead-free finishes, including OSP. It has a broad reflow process window which enables efficient soldering of medium and large boards containing different component sizes. Its remarkable organic properties allow it to endure multiple reflow cycles and produce low voiding. Additionally, the solder joint appears shiny and smooth, even on tiny deposits.
The ECORELTM FREE 305-21 boasts exceptional printing abilities, as depicted in the radar chart. These capabilities include high speed printing, prolonged steady tackiness, excellent abandon time, and effective pin in paste capability.
The chemical residues left on the PCB after soldering are inert, and ECORELTM FREE 305-21 has passed the Bono corrosion test, making it essential in managing the risk of electrochemical migration in electronics that are exposed to humidity and temperature.
