3M™ Hot Melt Adhesive 3797

Our 3M™ Hot Melt Adhesive 3797 is a temperature resistant, low viscosity adhesive which flows easily into small areas for effective coverage and protection, ideal for electrical potting. This 100% solids thermoplastic adhesive also provides a quick 30-second open bead time for potting even at depth. It is best used with our 3M™ Hot Melt Applicator PG II – excellent for high volume operations.

FEATURES:

• Hot melt adhesive ideal for potting of electrical and electronic components
• Low viscosity provides high flow rates for excellent coverage
• Ball and ring tested – adhesive exhibits good temperature resistance after application
• 30 second bead open time makes for effective potting at depth
• For use with 3M™ Hot Melt Applicator PG II, allowing for fast-paced production

APPLICATIONS:

• Electrical potting even at great depth
• Securing wires to resist strain and breakage
• Bundling wires for convenient handling
• Rigidizing components on printed circuit boards to add stability during assembly, shipping and end use
• Terminating coils
• Cable strain relief