Our 3M™ Hot Melt Adhesive 3797 is a temperature resistant, low viscosity adhesive which flows easily into small areas for effective coverage and protection, ideal for electrical potting. This 100% solids thermoplastic adhesive also provides a quick 30-second open bead time for potting even at depth. It is best used with our 3M™ Hot Melt Applicator PG II – excellent for high volume operations.
FEATURES:
Hot melt adhesive ideal for potting of electrical and electronic components
Low viscosity provides high flow rates for excellent coverage
Ball and ring tested – adhesive exhibits good temperature resistance after application
30 second bead open time makes for effective potting at depth
For use with 3M™ Hot Melt Applicator PG II, allowing for fast-paced production
APPLICATIONS:
Electrical potting even at great depth
Securing wires to resist strain and breakage
Bundling wires for convenient handling
Rigidizing components on printed circuit boards to add stability during assembly, shipping and end use
