Semiconductor
As demand for high-performance semiconductors increases, the semiconductor market is paying more attention to the importance of packaging technology. This technology will strengthen the competitiveness of the semiconductor industry and the electronics industry.
And semiconductor packaging material is at the core of responsive, reliable, robust electronic functionality. Supporting most stages of semiconductor packaging, from die attach the epoxy adhesive to tape carriers for packaging and transporting protection, Prostech provides you with cutting-edge materials technology, and technical support as a part of your team.
Prostech is confident our solution can enable your innovation ambitions toward thinner wafers, decreasing footprints, finer pitches, package integration 3D designs, wafer-level technology and high-volume production economies of scale, and so on.
Cutting-edge material technology used in Semiconductor Brochure
Semiconductor Packaging Process
Our product details for multiple applications in Semicon
- Non electrically conductive adhesive
- Electrically conductive adhesive
- UV dual cure adhesive
- Solf solder
- Underfill material
- Liquid encapsulant (Glob top)
- Dam & Fill
Packing
Useful Information
What is System-in-Package (SIP)?
What is System-in-Package (SiP)? System in a Package (SIP) pertains to a semiconductor device that integrates various chips, forming an
Notices when setup a PoP Assembly with Solder Paste and Flux
Solder Paste To prepare for component dipping with solder paste, it is crucial to start with a level reservoir. When
Package-on-Package Process and Solder Paste usage notices
Assembly Method There are two primary techniques for PoP assembly: pre-joined and on-the-fly. The key distinction between these methods is
