3M™ Light-To-Heat-Conversion Release Coating is ideal as part of our 3M™ Wafer Support System (WSS) – a complete, cost-effective solution for high-volume manufacturing of ultra-thin wafers for 3D TSV and related applications. The system features 3M™ Liquid UV-Curable Adhesive LC-3200 for temporary bonding of semiconductor wafers to glass carrier plates during backgrinding and high-temperature TSV processes, and our 3M™ Polyester Delaminating Tape 3305 which is used to peel the UV adhesive from the wafer with minimal residue and no post-peel cleaning. The 3M™ WSS is compatible with high-temperature/high vacuum processes, common process chemistries, and low-k dielectric materials.
FEATURES:
Helps manufacturers enable stress free, room temperature debonding of adhesive to glass carrier interface with laser irradiation
Ink coating delivers low-force release, allowing for glass carrier recycling
Enables room temperature debonding without high temperatures or harsh chemical cleaning solutions
Compatible with typical semiconductor chemistries and processes
Used as part of the 3M™ Wafer Support System
Typical Physical Properties and Performance Characteristics
