3M™ Light-To-Heat-Conversion Release Coating

3M™ Light-To-Heat-Conversion Release Coating is ideal as part of our 3M™ Wafer Support System (WSS) – a complete, cost-effective solution for high-volume manufacturing of ultra-thin wafers for 3D TSV and related applications. The system features 3M™ Liquid UV-Curable Adhesive LC-3200 for temporary bonding of semiconductor wafers to glass carrier plates during backgrinding and high-temperature TSV processes, and our 3M™ Polyester Delaminating Tape 3305 which is used to peel the UV adhesive from the wafer with minimal residue and no post-peel cleaning. The 3M™ WSS is compatible with high-temperature/high vacuum processes, common process chemistries, and low-k dielectric materials.

FEATURES:

• Helps manufacturers enable stress free, room temperature debonding of adhesive to glass carrier interface with laser irradiation
• Ink coating delivers low-force release, allowing for glass carrier recycling
• Enables room temperature debonding without high temperatures or harsh chemical cleaning solutions
• Compatible with typical semiconductor chemistries and processes
• Used as part of the 3M™ Wafer Support System