3M™ Low Static Polyimide Film Tape 5419 is a translucent, polyimide film-backed silicone adhesive tape with unique and extremely low electrostatic discharge properties.
FEATURES
- At room temperature the properties of polyimide and polyester film are similar. However, as the temperature increases or decreases, the properties of the polyimide film are less affected than polyester.
- Polyimide film does not soften at elevated temperatures, thus, the film provides an excellent release surface at elevated temperatures.
- Gold tab protection during wave solder of printed circuit boards.
- RoHS compliant.
APPLICATIONS
- Mask for printed circuit boards during wave solder or solder dip process.
- Used as release surface in fabrication of parts cured at elevated temperatures.
Property | Values | Unit | Test Method |
Adhesion to Steel | 22 | N/cm | D-3330 |
Tensile Strength at Break | 578 | N/cm | D-3759 |
Elongation at Break | 60 | % | D-3759 |
Backing Thickness | 1.0 | mil | D-3652 |
0.03 | mm | D-3652 | |
Total Tape Thickness | 2.7 | mil | D-3652 |
0.07 | mm | D-3652 | |
Temperature Use Range | -73 to 260 | °C | – |
-100 to 500 | °F | – | |
Dielectric Strength | 7000 | volts | D-149 |
Insulation Resistance | >1 x 106 | ohms | – |
Shlef Life | 3 | years | – |