3M™ Polycarbonate Carrier Tape 3200 Series features a precision process that creates ultra-small (less than 0.01mm) pocket holes, which is not possible using current conventional mechanical punch methods. Operators are able to maintain optimal vacuum pressure, prevent solder balls from sticking in pocket holes and reduce the amount of foreign material that may contaminate IC chips. The drilling process can also nearly eliminate debris from burr defects that may cause contamination of carrier tapes.
FEATURES:
Features extremely small pocket holes, helping reduce production delays due to solder bump sticking
Optical Precision Process drills ultra-small pocket holes of less than 0.01 mm
The process can greatly reduce burr debris which may contaminate IC chips
Typical surface resistivity of 10^5 ohms/sq. is ideal for static-sensitive components
