3M™ Polycarbonate Carrier 3000BD is cleaned and packaged in a Class 10,000 cleanroom environment and is excellent for wafer-level chip scale packages (WLCSP), bare dies, and processes that require cleanliness and high precision. Black, splice-free polycarbonate carrier features flat pocket bottoms to help reduce chip Z-axis movement and smoother throughput at pickup points. The tape delivers a pocket dimensional tolerance at +/- 0.05 mm with a ≤5° sidewall draft angle. Precisely formed pockets effectively fit passive components per ANSI/EIA guidelines.

FEATURES:

• For wafer-level chip scale packages (WLCSP), bare dies, and other semiconductor processes  requiring cleanliness and high precision
• Cleaned and packaged in a Class 10,000 cleanroom environment
• Precision pockets conform to chips more closely than traditional heat-formed pockets
• Excellent for corner protection in most tape widths, helping prevent die edge chipping
• Features a typical surface resistivity of 10^5 ohms/sq., ideal for static-sensitive components
• Splice-free polycarbonate carrier provides balanced electrostatic shielding and electrostatic decay properties