3M™ Polyimide Film Tape 5413 with DuPont™ Kapton® polyimide film and silicone adhesive used for PCB solder masking and other high temperature applications. This product is amber colored and 2.7 mil (69 microns) thick.
FEATURES
- The DuPont™ Kapton® polyimide film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated temperatures
- Is dimensionally stable at high temperatures, which helps reduce rework, helping to enable high productivity
- Is flame retardant, chemical and radiation resistant which helps protect surfaces to help reduce replacement costs
- The silicone adhesive’s high temperature performance helps reduce adhesive transfer which helps to eliminate cleaning, enabling high productivity
- Polyethylene tape core instead of cardboard
APPLICATIONS
- Mask for protection of gold fingers of printed circuit boards during wave solder or solder dip process.
- Release surface in fabrication of parts cured at elevated temperatures.
Property | Values | Unit | Test Method |
Adhesion to Steel | 24 | N/cm | D-3330 |
Tensile Strength at Break | 578 | N/cm | D-3579 |
Elongation at Break | 62 | % | D-3579 |
Backing Thickness | 1.0 | mils | D-3652 |
0.03 | mm | D-3652 | |
Total Tape Thickness | 2.7 | mils | D-3652 |
0.07 | mm | D-3652 | |
Temperature Use Range | -73 to 260 | °C | – |
-100 to 500 | °F | – | |
Dielectric Strength | 7000 | volts | D-149 |
Shelf Life | 36 | months | – |