Product Introduction
3M™ Scotch-Weld™ Epoxy Adhesive EC-2214 Hi-Temperature NF (new formulation) is a high-performance, one-part adhesive designed to deliver high strength, superior temperature resistance, and rigid, void-free bond lines. The new formulation improves reactivity for more consistent curing results. This dense, aluminum-filled adhesive has a smooth, high-density paste consistency that allows for precise dispensing and neat bond lines with negligible shrinkage, making it ideal for metal-to-metal bonding, potting, encapsulating components, and strengthening honeycomb panels. Requiring no mixing, it heat cures between 250°F and 300°F (121°C to 149°C) and performs reliably in operating temperatures from 180°F to 350°F (82°C to 177°C), bonding effectively to metals, composites, glass, and some plastics.
3M™ EC-2214 Features
- New formulation improves reactivity for consistent curing results
- High temperature performance with negligible shrinkage and strong bonds between 180°F to 350°F (82°C to 177°C)
- Dense, aluminum-filled composition ideal for metal-to-metal bonding and structural applications
- Convenient one-part formula requires no mixing
- Easy-to-dispense, high-density paste for precision bond lines
- Heat cures between 250°F to 300°F (121°C to 149°C)
- Suitable for potting, encapsulating, and honeycomb panel reinforcement
- Provides void-free bond lines on composites and metals
3M™ EC-2214 Applications
- Metal-to-metal bonding for exterior and structural applications
- Potting and encapsulating components
- Reinforcing honeycomb panels and structural assemblies
- Composite and metal bonding requiring void-free bond lines
- Applications requiring high-temperature resistance and precise bond lines
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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| Property | Value |
|---|---|
| Application | Composite Bonding, Metal Bonding |
| Brands | Scotch-Weld™ |
| Container Size (Imperial) | 5.96 Ounce |
| Container Size (Metric) | 168.96 g |
| Product Color | Gray |
