Product Introduction
3M™ Scotch-Weld™ Epoxy Adhesive EC-3542 B/A FR is a lightweight, flame-retardant, two-part epoxy adhesive engineered for structural bonding in aerospace applications. This advanced adhesive uses 3M™ Glass Bubble technology to achieve a low density of 0.7 g/cc, offering significant weight savings without sacrificing performance. It features a fast room-temperature cure and short gel time, enhancing manufacturing efficiency. Its thixotropic, non-sag formula makes it perfect for vertical applications like edge close-outs and panel forming, while its high torque resistance is ideal for insert potting. This pumpable adhesive is compatible with automated dispensing systems and meets FAA flame-retardant standards for aircraft interior safety.
3M™ EC-3542 B/A FR Features
- Low Density: A specific gravity of 0.7 g/cc provides significant weight savings.
- Fast Cure: Offers a short gel-time and rapid cure at room temperature for high efficiency.
- High Torque Resistance: Well-suited for demanding insert potting applications.
- Pumpable Formula: Compatible with automated and bulk dispensing equipment.
- Non-Sag (Thixotropic): Ideal for vertical edge close-outs and panel forming.
- Flame Retardant: Complies with FAA 14CFR 25.853 (a) for aircraft interior safety.
- Tough & Impact-Resistant: Forms strong structural bonds with excellent compressive strength.
3M™ EC-3542 B/A FR Applications
- Honeycomb panel bonding and performing edge close-outs.
- Insert potting for high-torque applications in aerospace interiors.
- Fabricating galley structures, partitions, luggage bins, and lavatories.
- Assembling crew rest compartments, seating structures, and ceiling panels.
- Constructing closets, bar units, coatrooms, and stowage compartments.
- Bonding sidewall panels, cargo bay panels, and passenger doors.
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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Typical Properties
| Property | Value |
|---|---|
| Adhesive Type | Epoxy |
| Container Size (Imperial) | 6.76 fl oz, 15 gal |
| Container Size (Metric) | 56.78 mL, 200 L |
| Cure Temperature | Room Temperature |
| Density | 0.7 g/cc |
| Features | Flame Retardant |
| Industries | Aerospace |
| Product Form | Cartridge, Bulk |
| Shelf Life | 6 Month |
