3M™ Scotch-Weld™ Epoxy Potting Compound DP270 is low viscosity for easy dispensing and potting. It is non-corrosive to copper, minimal exotherm and very low shrinkage – making it well-suited for potting and bonding electronic and electrical components.
FEATURES
- Features a 70 minute work life
- Rigid potting compound is non-corrosive to copper
- Minimal exotherm and very low shrinkage
- Flammability testing per UL94 HB
Property | Values | Unit |
Color | Clear or Black | – |
Viscosity | 7000 – 16,000 | cps |
Cure Shrinkage | 0.08 | % |
Shore D Hardness | 83 | – |
Dielectric Strength | 850 | volts/mil |
Volume Resistivity | 4.1 x 1014 | ohm-cm |
Shelf Life | 2 | years |