Product Introduction
3M™ Scotch-Weld™ Structural Core Splice Film AF 3002 is a low-density, thermally expanding adhesive film designed for reinforcing, splicing, and filling mismatched areas in honeycomb core. With a controlled expansion rate of 35-55%, it provides a precise solution for creating strong, uniform bond lines. This dry-to-the-touch film offers a cleaner, more efficient alternative to liquid adhesives, reducing waste and simplifying application. It cures flexibly between 250°F (121°C) and 350°F (176°C) and features a low-sag formula to minimize rework. Ideal for aerospace manufacturing and MRO, AF 3002 ensures predictable bonding for composites, metal-to-metal, and metal-to-honeycomb assemblies.
3M™ AF 3002 Features:
- Controlled Expansion: Expands 35-55% for joining mismatched areas and reinforcing honeycomb core.
- Variable Curing Temperature: Helps streamline production with a cure range of 250°F (121°C) to 350°F (176°C).
- Low Sag Formula: Stays in place during cure to help eliminate rework and ensure precision.
- Clean Application: Dry-to-the-touch film enables precise application without the mess of liquid adhesives.
- Aerospace Qualified: Meets multiple aerospace customer specifications for reliable performance.
- Efficient Assembly: Promotes faster assembly and fixturing with uniform, predictable bond lines.
3M™ AF 3002 Applications:
- Splicing and reinforcing honeycomb core structures in aerospace manufacturing.
- Filling mismatched areas in composite and metallic assemblies.
- Metal-to-metal and metal-to-honeycomb bonding using heat press or lamination.
- Applications requiring strong, uniform bond lines for structural integrity.
- Assembly operations seeking to reduce waste and accelerate production with cleaner processing.
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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| Property | Value |
|---|---|
| Adhesive Type | Epoxy |
| Maximum Cure Conditions (Celsius) | 177 ℃ |
| Maximum Cure Conditions (Fahrenheit) | 350 ℉ |
| Maximum Operating Temperature (Celsius) | 177 ℃ |
| Maximum Operating Temperature (Fahrenheit) | 350 ℉ |
| Minimum Cure Conditions (Celsius) | 121 ℃ |
| Minimum Cure Conditions (Fahrenheit) | 250 ℉ |
| Minimum Operating Temperature (Celsius) | -55 ℃ |
| Minimum Operating Temperature (Fahrenheit) | -67 ℉ |
| Nominal Adhesive Thickness (Imperial) | 50 mil |
| Nominal Adhesive Thickness (Metric) | 1.27 mm |
| Product Color | Off White |
| Product Form | Roll, Sheet |
| Storage Environment | Freezer Storage |
| Dimensions and Classifications | |
| Overall Length (Imperial) | 18 yd, 24 in, 36 yd |
| Overall Length (Metric) | 16 m, 33 mm, 610 m |
| Overall Width (Imperial) | 1 in, 10 in, 20 in |
| Overall Width (Metric) | 25.4 mm, 254 mm, 508 mm |
