Product Introduction
3M™ Scotch-Weld™ Structural Core Splice Film AF 3024 is a low-density, thermally expanding adhesive film engineered for aerospace applications. It features a remarkable 250% expansion rate, making it exceptionally effective for filling large gaps and joining significantly mismatched honeycomb core structures. This heat-curing film offers a flexible curing temperature range from 250°F (121°C) to 350°F (176°C) and achieves full expansion even at slow heat-up rates. Its low-sag formula ensures the adhesive stays in place during curing, which helps to minimize rework and improve production efficiency. Qualified to meet multiple aerospace customer specifications, AF 3024 is a reliable solution for both manufacturing and MRO.
3M™ AF 3024 Features:
- High Expansion Rate: Thermally expands up to 250% to successfully join greatly mismatched structures.
- Variable Curing: Flexible curing temperature from 250°F (121°C) to 350°F (176°C) streamlines production.
- Low Sag Formula: Minimizes adhesive migration during cure, which helps to eliminate rework.
- Aerospace Qualified: Qualified to multiple aerospace customer specifications for trusted performance.
- Process Robustness: Maintains full expansion even at slow heat-up rates as low as 0.5°F/minute.
- Inventory Consolidation: Versatile performance allows for standardization of inventory.
3M™ AF 3024 Applications:
- Splicing and reinforcing honeycomb core structures in aerospace manufacturing.
- Filling large mismatched areas and gaps in aerospace composite assemblies.
- Applications where high thermal expansion is required to accommodate structural voids.
- Production environments seeking to reduce rework and improve process efficiency.
- Flexible bonding processes that require a variable curing temperature range.
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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| Property | Value |
|---|---|
| Adhesive Type | Epoxy |
| Factory ISO Certification | No ISO Certification information available |
| Maximum Cure Conditions (Celsius) | 177 ℃ |
| Maximum Cure Conditions (Fahrenheit) | 350 ℉ |
| Maximum Operating Temperature (Celsius) | 176 ℃ |
| Maximum Operating Temperature (Fahrenheit) | 350 ℉ |
| Minimum Cure Conditions (Celsius) | 121 ℃ |
| Minimum Cure Conditions (Fahrenheit) | 250 ℉ |
| Minimum Operating Temperature (Celsius) | -55 ℃ |
| Minimum Operating Temperature (Fahrenheit) | -67 ℉ |
| Nominal Adhesive Thickness (Imperial) | 25 mil, 50 mil |
| Nominal Adhesive Thickness (Metric) | 0.635 mm, 1.27 mm |
| Product Color | Off White |
| Product Form | Sheet, Roll |
| Storage Environment | Freezer Storage |
| Overall Length (Imperial) | 24 in, 325 in |
| Overall Length (Metric) | 8.3 mm, 610 m |
| Overall Width (Imperial) | 1 in, 3.25 in, 10 in |
| Overall Width (Metric) | 25.4 mm, 83 mm, 254 mm |
