3M™ Thermally Conductive Silicone Interface Pad 5549S is a moderately conformable and medium-soft pad with very high thermal conductivity of 3.5 W/m-K (ASTM D5470). This pad consists of a slightly tacky silicone elastomeric sheet filled with thermally conductive ceramic particles. It is designed to transfer heat from heat generating components to heat sinks and cooling devices, improving device reliability and extending the component’s life.
3M™ Thermally Conductive Silicone Interface Pad 5549S has a medium-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The “S” supporting layer (permanent film carrier) has a non-tacky surface, providing excellent workability, puncture resistance, and the flexibility to rework materials. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Key Features
Very high thermal conductivity and good electrical insulation properties
Good softness and conformability even to non-flat surfaces
Thin polymeric film carrier supported on one side for good converting and handling properties
Slight tack allows pre-assembly
Good dielectric properties
Good wettability for better thermal conductivity
High temperature resistance
Tacky both sides
Larger sheet size is available
Recommended Applications
Heat transfer between PCB and heat sink
Integrated chip (IC) packaging heat conduction
Chip on film (COF) heat dissipation
Gap filling in electronic devices
Decrease of compression stress to electronic parts by thermal pad softness
Examples:
LED displays
Electric vehicle (EV) batteries
Wireless charging units
Satellite navigation
Sensors
Process control equipment
Test & measurement devices
