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Home > Products > By Manufacturer > 3M > 3M™ Universal Cover Tape (UCT) 2688A

3M™ Universal Cover Tape (UCT) 2688A

  • Product code: 2688A
  • Manufacturer: 3M
  • Package size: 300m Log Roll
  • Shelf Life: 2 years
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3M™ Universal Cover Tape (UCT) 2688A is specially designed with a transparent polypropylene film and synthetic room temperature pressure sensitive adhesive (PSA) strips. It also has static dissipative film on the component side.

3M cover tape 2688A provides a very smooth peeling process and is appropriate for wafer level chip scale packages (WLCSP), bare dies and ultra-thin packages.

FEATURES:

  • Transparent polypropylene film tape with a layer of static dissipative coating on the component side and a synthetic, room temperature pressure-sensitive adhesive strip along each edge
  • Features an innovative peeling design with repeatable tracks and score lines to remove only the center part of the cover tape
  • Designed to offer smooth peeling performance with a tight range, helping reduce vibration and component movement, while increasing overall pick-and-place productivity
  • Highly recommended for WLCSP, bare dies and ultra-thin packages that require a high-performing cover tape
  • Works well on 3M™ Polycarbonate Carrier Tapes
  • 300 m rolls are available in standard widths of 5.4 mm, 9.3 mm, 13.3 mm and 21.3 mm

Typical Properties

Description   Units Typical performance Test notes Test method
Material properties Backing type   Polyester 1  
Adhesive type   PSA  
Sealing temp ºC Room Temperature  
Physical properties Tensile strength N/mm Width 6.0 2 Modified ASTM-D3759
  Elongation % 150 2 Modified ASTM-D3759
  Haze % 2.4 3 ASTM-D1003
  Transmission % 85 3 ASTM-D1003
  Thickness mm (in) 0.048 2 ASTM-D3652
Electrical properties Resistivity (Back side) Ohms/sq 10^12 4 ANSI/ESD S541-2008
  Resistivity (Component side) Ohms/sq 10^7 4 ANSI/ESD S541-2008
Product format Core type Material Plastic    
  Core inner diameter mm (in) 76.2 (3.0)    
  Roll diameter mm (in) 190.5 (7.5)    
  Roll length m (yd) 300 (328)    

Resources

TDS:Download

Related Article

Semiconductor Packaging
https://prostech.ph/semiconductor-packaging/

ChallengeChiplet design – a response and a driver for smaller, thinner chipsSolutionVersatile carrier tapes and cover tapes for semiconductor transport

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