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Home > Products > By Manufacturer > 3M > 3M™ UV Activated Film 81050
3M™ UV Activated Film 81050 3M™ 81050 Prostech Philippines

3M™ UV Activated Film 81050

  • Product code: 3M™ 81050
  • Manufacturer: 3M
  • Package size:
  • Shelf Life: 18 months
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  • Product Details
  • Typical Properties
  • Resources
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  • Product Introduction
  • 3M™ 81050 Features
  • 3M™ 81050 Applications
  • About Prostech

Product Introduction

3M™ UV Activated Film 81050 is an innovative adhesive that combines the handling ease of a pressure-sensitive tape with the semi-structural strength of a curable adhesive. This clear film is activated by UV light, allowing for precise, low-shrinkage bonds on small or heat-sensitive components without the need for high temperatures or pressures. Prior to UV activation, it is tacky and can be easily die-cut for precision parts. After activation, it achieves green strength within an hour and full bond strength within 24 hours at room temperature, making it a robust alternative to traditional bonding methods for electronics and automotive displays.

3M™ 81050 Features

  • Combines the benefits of tapes and liquid adhesives; activated with light, not heat.
  • Processes like a pressure-sensitive adhesive (PSA) before UV activation, including die-cutting capability.
  • Achieves full bond strength at room temperature within 24 hours after UV activation.
  • Bonds with very low shrinkage for a good visual appearance.
  • Creates excellent bond strength on most medium and high surface energy materials.
  • Delivered in a dual-linered configuration with a thin 50 μm film thickness.

3M™ 81050 Applications

  • Ideal for bonding small components such as laptop trackpads and fingerprint sensors.
  • Used in smartphone front cameras and automotive display assemblies.
  • Suitable for enclosure bonding in electronics.
  • Perfect for bonding heat-sensitive components where high temperatures are a concern.

About Prostech

Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:

  • PCB Assembly Materials
  • Cleaning & Degreaser
  • Circuit Board Protection
  • Thermal Management Solutions
  • EMI Shielding
  • General Assembly Adhesives
  • Elastomeric Materials
  • Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines

Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.

International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
Need help selecting the right product or solution?

Contact Prostech Philippines today

Typical Properties

Product Specifications
Application Bonding
Brands 3M™
Curing Temperature (Celsius) 25 °C
Curing Temperature (Fahrenheit) 77 °F
Density 1.2 g/cc
Maximum Cure Conditions (Celsius) 45 °C
Maximum Cure Conditions (Fahrenheit) 113 °F
Product Color Translucent
Shear Strength 1754 psi
Shelf Life 18 Month
Dimensions and Classifications
Overall Thickness (Imperial) 2 mil
Overall Thickness (Metric) 50 micron

Resources

TDS:Download

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