3M™ UV-Curable Adhesive LC-3200

3M™ UV-Curable Adhesive LC-3200 is ideal as part of our 3M™ Wafer Support System (WSS) – a complete, cost-effective solution with high throughput for high-volume manufacturing of ultra-thin wafers for IGBT/Power IC 3D TSV and related applications. The system also features 3M™ Light-To-Heat-Conversion Release Coating (LTHC) efficient, damage-free semiconductor wafer debonding after backgrinding and other standard semiconductor processes, and our 3M™ Polyester Delaminating Tape 3305 which is used to peel the UV adhesive from the wafer with minimal residue and no post-peel cleaning. The 3M™ WSS is compatible with high temperature/high vacuum processes, common process chemistries and low-k dielectric materials.

FEATURES:

• Excellent for semiconductor wafer bonding and debonding with high throughput
• UV-curable adhesive requires no heat for reliable bonding during high-temperature processes
• 100% solid acrylic adhesive removes the need to use solvents in this stage of the semiconductor manufacturing process
• Good heat and chemical resistance, easy and clean removal
• Compatible with typical semiconductor process chemistries and processes
• Used as part of the 3M™ Wafer Support System