3M™ UV-Curable Adhesive LC-3200 is ideal as part of our 3M™ Wafer Support System (WSS) – a complete, cost-effective solution with high throughput for high-volume manufacturing of ultra-thin wafers for IGBT/Power IC 3D TSV and related applications. The system also features 3M™ Light-To-Heat-Conversion Release Coating (LTHC) efficient, damage-free semiconductor wafer debonding after backgrinding and other standard semiconductor processes, and our 3M™ Polyester Delaminating Tape 3305 which is used to peel the UV adhesive from the wafer with minimal residue and no post-peel cleaning. The 3M™ WSS is compatible with high temperature/high vacuum processes, common process chemistries and low-k dielectric materials.
FEATURES:
- Excellent for semiconductor wafer bonding and debonding with high throughput
- UV-curable adhesive requires no heat for reliable bonding during high-temperature processes
- 100% solid acrylic adhesive removes the need to use solvents in this stage of the semiconductor manufacturing process
- Good heat and chemical resistance, easy and clean removal
- Compatible with typical semiconductor process chemistries and processes
- Used as part of the 3M™ Wafer Support System
3M™ Liquid UV-Curable Adhesive LC-3200
| Property | Value |
| Base resin | Acrylic |
| Color | Clear, light yellow |
| Density | 1.03 |
| Viscosity | 3000 cPs (@25ºC) |
Typical Adhesive Properties
| 3M™ Liquid UV-Curable Adhesive LC-3200 | |||
| Modulus (@ 25°C) | 1.46 x 10^8 | Pa | DMA |
| Tg | 50°C | °C | DMA |
| Shrinkage | 5.2 | % | – |
| 180° Peel Strength 0.15 N/25mm — (mirror wafer) |
0.15 | N/25mm | – |
