The 3M Liquid UV-Curable Adhesive LC-4200 is an acrylic adhesive that cures under UV light and has no solvent content. It is specifically formulated for bonding silicon wafers and other substrates to glass carriers using the 3M Wafer Support System. The LC-4200 adhesive can withstand post-processing of mounted wafers at temperatures up to 180 C for extended periods, with short excursions up to 200 C. However, the adhesive’s performance may vary depending on the specific substrate materials and topography, so it should be tested for each application.
FEATURES:
Excellent for semiconductor wafer bonding and debonding with high throughput
UV-curable adhesive requires no heat for reliable bonding during high-temperature processes
100% solid acrylic adhesive removes the need to use solvents in this stage of the semiconductor manufacturing process
Good heat and chemical resistance, easy and clean removal
Compatible with typical semiconductor process chemistries and processes
Used as part of the 3M™ Wafer Support System
Typical Properties
3M™ Liquid UV-Curable Adhesive LC-4200
Property
Value
Base resin
Acrylic Functional Polymer
Color
Clear, Orange-Brown
Density
1.035
Viscosity
2150 cP (@ 25°C)
Typical Adhesive Properties
3M™ Liquid UV-Curable Adhesive LC-4200
Modulus (@ 25°C)
9.4 x 10^8
Pa
DMA
Elongation to Break
15
%
ASTM D-698
Adhesion
0.2 – 1.5*
N/25mm
90° peel @ 125mm/min
*Adhesion depends on substrate and thermal history.
