The 3M Liquid UV-Curable Adhesive LC-5200 is an acrylic adhesive that cures under UV light and has no solvent content. It is specifically formulated for bonding silicon wafers and other substrates to glass carriers using the 3M Wafer Support System. The LC-5200 adhesive can withstand post-processing of mounted wafers at temperatures up to 180ºC for extended periods, with short excursions up to 200ºC. However, the adhesive’s performance may vary depending on the specific substrate materials and topography, so it should be tested for each application.
FEATURES:
Excellent for semiconductor wafer bonding and debonding with high throughput
UV-curable adhesive requires no heat for reliable bonding during high-temperature processes
100% solid acrylic adhesive removes the need to use solvents in this stage of the semiconductor manufacturing process
Good heat and chemical resistance, easy and clean removal
Compatible with typical semiconductor process chemistries and processes
