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3M™ Wafer De-Taping Tape 3305

  • Product code: 3305
  • Manufacturer: 3M
  • Package size:
  • Shelf Life:

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3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ Wafer Support Systems (WSS) adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.

FEATURES

  • Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
  • Transparency allows for inspection without tape removal
  • High instant adhesion to substrate
  • Good holding power

APPLICATIONS

Wafer De-Taping

PropertyValuesUnitTest Method
Tape Thickness0.068mmJIS Z 0237
Tensile Strength78.4N/cm
Elongation125%
Adhesion Strength9.41N/cm

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