3M™ Wafer De-Taping Tape 879 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
FEATURES:
- Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
- Transparency allows for inspection without tape removal
- High instant adhesion to substrate
- Good holding power
Typical Physical Properties
Properties | Unit | Value | Test Method |
Tape Thickness | mm | 0.110 | JIS Z 0237 |
Tensile Strength | N/cm | 66.7 | |
Elongation | % | 120 | |
Adhesion Strength (SUS)*1 | N/cm | 15.2 |