Henkel Loctite Ablestik 55, formerly Emerson and Cuming ECCOBOND, is a two component, unfilled, epoxy adhesive resin that is used for electronic assemblies, anchoring inserts, hermetic sealing, and bonding of plastics, metal, ceramics, and glass. It offers low viscosity, good wetting, and resistance to water, chemicals, and solvents
Typical Use:
Used for electronic component assembly, staking of adjustment and calibration screws and anchoring inserts, end fills or hermetic sealing.
Brand:
Ablestik
Chemical Composition:
Epoxy
Color:
Milky White
Components:
2 part
Cure System:
Room Temperature/Heat
Cure Time:
Catalyst 9: 16 to 24h @ 25 °C; Catalyst 11: 8 to 16h @ 80 °C; Catalyst 23LV: 24h @ 25 °C
Dielectric Strength:
Catalyst 9: 17 kV/mm
Flash Point:
254 °C
Mix Ratio:
Catalyst 9: 100:15.5 by volume, 100:13.5 by weight; Catalyst 11: 100:17 by volume, 100:16 by weight; Catalyst 23LV: 100:32 by volume, 100:28 by weight
Service Temperature:
Catalyst 9: -40 to 130 °C; Catalyst 11: -55 to 155 °C; Catalyst 23LV: -65 to 105 °C
