Prostech Philippines

LOCTITE ABLESTIK 2035SC, Proprietary Hybrid Chemistry, Die Attach, Non-Conductive Adhesive

LOCTITE ABLESTIK 2035SC is non-conductive die attach adhesive has been formulated for use in high throughput die-attach applications. This material is designed to minimize stress and resulting warpage between the dissimilar surfaces.

FEATURES:

Non-conductive
Single component
Fast cure
Low cure temperature
Low stress

RECOMMENDED APPLICATIONS:

Compact Camera Module – Die attach

Cure Type	Heat
Appearance	Red
Viscosity (Brookfield) 25°C, 5 rpm	11,000
Glass Transition Temperature (Tg)	120
Modulus @ 25°C	2,500
CTE Below Tg	54
CTE Above Tg	128
Recommended Cure	90 sec. @ 110°C

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BERGQUIST® LIQUI-FORM TLF LF2000 – Thermally Conductive Material

https://prostech.ph/bergquist-liqui-form-tlf-lf2000-thermally-conductive-material-2/

BERGQUIST® LIQUI-FORM TLF LF2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between

Loctite Ablestik 2035SC

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