Bectron® PK 4340
Bectron® PK 4340 is a one-component polyurethane resin that cures into a soft, vibration-resistant duroplastic. With excellent thixotropic flow and environmental compatibility, it is ideal for selective coating in electronics manufacturing.
Bectron® PK 4340 Features:
- Single-component system with soft cure
- Excellent thixotropy for precision coating
- Environmentally friendly formulation
Bectron® PK 4340 Applications:
- Vibration protection for delicate components
- Partial or selective coating of SMDs and PCBs
- Dam and fill systems with lower viscosity resins
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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Properties of components as supplied
|
Property |
Condition |
Value |
Unit |
|
Viscosity, DIN 53019 |
D=15 s-1, 23°C |
9.500 ± 1.500 |
mPas |
|
Density, DIN EN ISO 2811-2 |
23°C |
1,23 ± 0,02 |
g/cm³ |
|
Shelf life |
23°C |
6 |
months |
Pot-life, gel-time, curing conditions
|
Property |
Value |
Value |
Unit |
|
Temperature |
80 |
90 |
°C |
|
Gel-time |
5 ± 2 |
|
min |
|
Curing |
65 ± 5 |
30 ± 5 |
min |
Thermal properties of cured compound
|
Property |
Condition |
Value |
Unit |
|
Coefficient of thermal expansion, Beck Test M 56 |
-20°C to + 90°C |
200·10-6 |
K-1 |
|
Thermal conductivity, DIN 52616 |
23°C |
0,18 ± 0,02 |
W/mK |
