BECTRON® SA 70P1-34 is a white silicone paste adhesive designed for dependable sealing and bonding in electronics. It offers strong unprimed adhesion, excellent elongation, and long-term thermal reliability, making it suitable for components exposed to vibration, movement, or thermal expansion.
BECTRON® SA 70P1-34 Features:
Adheres to FR4, PBT, aluminium, copper without primer
White non-sag paste ideal for vertical applications
Shore A hardness of 34 and 580% elongation
Tensile strength of 2 MPa for secure bonding
Tack-free in 15 minutes; full cure in 24 hours
Thermal resistance up to +200 °C for 20,000 hours
BECTRON® SA 70P1-34 Applications:
Sealing enclosures and connectors in electronics
Flexible bonding for thermally mismatched materials
Gap filling under thermal or mechanical stress
Applications with high movement or vibration exposure
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
Technical Added Value to customer Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers. Need help selecting the right product or solution?
