BECTRON® SA 70P9-60 is a black silicone adhesive and sealant designed for rigid, high-strength bonding in electronics. It adheres well without primer to metals and polymers, cures quickly, and provides excellent mechanical resistance and heat durability up to +200 °C.
BECTRON® SA 70P9-60 Features:
Strong unprimed adhesion to FR4, PBT, aluminium, and copper
Black paste formulation resists sagging
3-minute tack-free time and 24-hour full cure
Shore A hardness of 60 and tensile strength of 2.35 MPa
200% elongation for moderate flexibility
Thermal stability up to +200 °C over 20,000 hours
BECTRON® SA 70P9-60 Applications:
Structural bonding of electronic parts
Sealing connectors and housings
Gap filling in assemblies with varied expansion rates
Use in high-temperature, vibration-prone environments
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
Technical Added Value to customer Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers. Need help selecting the right product or solution?
