Thermally Conductive, Silicone-Free Gap Filling Material
| Technology | Silicone free |
| Appearance (cured) | Orange |
| Appearance – Part A | Yellow |
| Appearance – Part B | Red |
| Cure | Room temperature cure or Cure at elevated temperatures |
| Application | Thermal management, TIM (Thermal Interface Material |
| Mix Ratio by weight: Part A: Part B | 1 : 1 |
| Mix Ratio by volume: Part A: Part B | 1 : 1 |
| Solids Content, % | 100 |
| Operating Temperature Range |
-60 to 125ºC |
FEATURES AND BENEFITS
● Thermal Conductivity: 1.1 W/m-K
● No silicone outgassing or extraction
● Ultra-conforming, designed for fragile and low-stress
applications
● Ambient and accelerated cure schedules
● 100% solids – no cure by-products
BERGQUIST GAP FILLER TGF 1100SF is a high performance, thermally conductive liquid gap filling material whichexhibits low modulus properties then cures to a soft,flexible eastomer, helping reduce thermal cycling stresses during operation and virtually eliminating stress during assembly of low-stress applications.
TYPICAL APPLICATIONS
● Hard disk assemblies
● Silicone-sensitive electronics
● Filling various gaps between heat-generating devices to heat sink and housing
● Mechanical switching relay
● Silicone-sensitive optic components
● Dielectric for bare-leaded devices
Typical Properties
TYPICAL PROPERTIES OF UNCURED MATERIAL
The viscosity of the BERGQUIST GAP FILLER TGF 1100SF material is temperature dependent. The table below provides the multiplication factor to obtain viscosity at various temperatures. To obtain the viscosity at a given temperature, look up the multiplication factor at that temperature and multiply the corresponding viscosity at 25°C.
TYPICAL UNCURED PROPERTIES
| Part A Properties | |
| Viscosity @ 20 °C | 1.43 |
| Viscosity @ 25 °C | 1.0 |
| Viscosity @ 35 °C | 0.58 |
| Viscosity @ 45 °C | 0.39 |
| Viscosity @ 50 °C | 0.32 |
| Part B Properties | |
| Viscosity @ 20 °C | 1.57 |
| Viscosity @ 25 °C | 1.0 |
| Viscosity @ 35 °C | 0.5 |
| Viscosity @ 45 °C | 0.3 |
| Viscosity @ 50 °C | 0.24 |
Mixed Properties
| Mixed Viscosity, Brookfield RV, Helipath,25 °C, mPa·s (cP) | |
| hSpindle TF, speed 2 rpm | 450,000 |
| Density, ASTM D792, g/cc | 2.0 |
| Pot Life @ 25 °C (time to double viscosity), minutes: | |
| GAP FILLER TGF 1100SF-15 (Fast cure) | 15 |
| GAP FILLER TGF 1100SF-240 (Slow cure) | 240 |
| Shelf Life @ 25ºC , days | 180 |
TYPICAL CURE SCHEDULE
BERGQUIST GAP FILLER TGF 1100SF is available with different curing characteristics to better suit your process. BERGQUIST GAP FILLER TGF 1100SF-15 reacts and cures faster than BERGQUIST GAP FILLER TGF 1100SF-240.
| Typical Work Life | |
| GAP FILLER TGF 1100SF-15, minutes | 15 |
| GAP FILLER TGF 1100SF-240, minutes | 240 |
| Typical Cure Time | |
| GAP FILLER TGF 1100SF-15: | |
| @ 25 °C, hours | 3 |
| @ 100°C, minutes | 20 |
| GAP FILLER TGF 1100SF-240: | |
| @ 25 °C, hours | 24 |
| @ 100°C, minutes | 120 |
TYPICAL PROPERTIES OF CURED MATERIAL
| Physical Properties | |
| Hardness, Shore 00, Thirty second delay value, ASTM D2240 | 60 |
| Heat Capacity, ASTM E1269, J/g-K | 0.9 |
| Flammability, UL 94 | V-0 |
| Electrical Properties | |
| Dielectric Strength, ASTM D149, V/mil | 400 |
| Dielectric Constant , ASTM D150 @ 1,000 Hz | 5.0 |
| Volume Resistivity, ASTM D257, ohm-cm | 1×10^10 |
| Thermal Properties | |
| Thermal Conductivity, ASTM D5470, W/(m-K) | 1.1 |
