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BERGQUIST GAP FILLER TGF 1450

  • Product code: TGF 1450
  • Manufacturer: Henkel
  • Package size:
  • Shelf Life: 6 months

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A two-part, high performance, thermally conductive liquid gap filling material.

TechnologySilicone
Appearance (cured) Blue
Appearance – Part A Blue
Appearance – Part B Light blue
Cure Heat cure or Room temperature
Application Thermal management,
TIM (Thermal Interface Material)
Mix Ratio by weight: Part A: Part B1 : 1
Mix Ratio by volume: Part A: Part B1 : 1
Operating Temperature Range-60 to 175ºC
UL Flammability RatingUL 94 V-0

FEATURES AND BENEFITS

● Thermal Conductivity: 1.5 W/m-K
● Ultra-conforming with excellent wet-out for near zero interface stress
● No cure by-products
● Low density for weight sensitive application
● Excellent low and high temperature mechanical and chemical stability
● Shear thinning viscosity for ease of dispens

TYPICAL APPLICATIONS

  •  Automotive electronics (HEV, NEV, batteries)
  • Lighting

TYPICAL PROPERTIES OF UNCURED MATERIAL

Viscosity, Capillary, ASTM D5099, Pa∙s*: 
   High shear, Shear Rate 3,000 s^-130
Viscosity, Parallel Plate, ASTM D2196, Pa∙s*: 
   Low shear, Shear Rate 1 s^-1200
   Flow viscosity measured on Parallel Plate
rheometer		 
*Part A and B measured separately.
Density, ASTM D792, g/cc		1.85
Pot life @ 25°C, ASTM D4473, minutes60

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties 
Hardness, Shore 00, 30 second delay, ASTM D224040
Heat Capacity, ASTM D1269, J/g-K1.0
Electrical Properties 
Dielectric Strength, ASTM D149, V/mil275
Dielectric Constant, ASTM D150, 1,000Hz6.4
Volume Resistivity, ASTM D257, ohm-meter1×10^10
Thermal Properties 
Thermal Conductivity, ASTM D5470, W/(m-K)1.5

 

 

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