A thermally conductive, liquid gap filler material.
| Technology | Silicone |
| Appearance (cured) | Pink |
| Appearance – Part A | Pink |
| Appearance – Part B | White |
| Cure | Room temperature cure or Heat cure |
| Application | Thermal management, TIM (Thermal Interface Material) |
| Mix Ratio by weight: Part A: Part B | 1 : 1 |
| Mix Ratio by volume: Part A: Part B | 1 : 1 |
| Solids Content, % | 100 |
| Operating Temperature Range | -60 to 200ºC |
FEATURES AND BENEFITS
● Thermal Conductivity: 2.0 W/m-K
● Ultra-conforming, designed for fragile and low-stress applications
● Ambient and accelerated cure schedules
● 100% solids – no cure by-products
● Excellent low and high temperature mechanical and chemical stability
BERGQUIST GAP FILLER TGF 2000 is a high performance, thermally conductive, liquid gap filling material supplied as a two-component, room or elevated temperature curing system. The material provides a balance of cured material properties and good compression set (memory). The result is a soft, thermally conductive, form-in-place elastomer ideal for coupling “hot” electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, BERGQUIST GAP FILLER TGF 2000 flows under pressure like a grease. After cure, it does not pump from the interface as a result of thermal cycling and is dry to the touch.
TYPICAL APPLICATIONS
● Automotive electronics (HEV, NEV, batteries)
● Telecommunications
● Computer and peripherals
● Thermally conductive vibration dampening
● Between any heat-generating semiconductor and a heat
sink
TYPICAL PROPERTIES OF UNCURED MATERIAL
|
Spindle TF, speed 20 rpm |
300,000 |
|
Density, ASTM D792, g/cc |
2.9 |
|
Pot Life @ 25ºC , time for viscosity to double |
@ 15 minutes @ 60 minutes @ 600 minutes |
|
Shelf Life @ 25ºC , days |
180 |
TYPICAL CURE SCHEDULE
|
Cure Schedule |
1 to 2 hours @ 25°C 5 minutes @ 100°C |
|
Alternative Cure Schedule 1 |
3 to 4 hours @ 25°C 15 minutes @ 100°C |
|
Alternative Cure Schedule 2 |
3 days @ 25°C 1 hour @ 100°C |
|
Rheometer – time to read 90% cure. |
|
TYPICAL PROPERTIES OF CURED MATERIAL
| Physical Properties | |
| Hardness, Shore 00, Thirty second delay value, ASTM D2240 | 70 |
| Heat Capacity, ASTM E1269, J/g-K | 1.0 |
| Flammability, UL 94 | V-0 |
| Electrical Properties | |
| Dielectric Strength, ASTM D149, V/mil | 500 |
| Dielectric Constant , ASTM D150 @ 1,000 Hz | 7.0 |
| Volume Resistivity, ASTM D257, ohm-cm | 1×10^ |
| Thermal Properties | |
| Thermal Conductivity, ASTM D5470, W/(m-K) | 2.0 |
