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Home > Specialty Materials > BERGQUIST GAP FILLER TGF 2000

BERGQUIST GAP FILLER TGF 2000

  • Product code: TGF 2000
  • Manufacturer: Henkel
  • Package size:
  • Shelf Life: 180 days

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A thermally conductive, liquid gap filler material.

Technology Silicone
Appearance (cured) Pink
Appearance – Part A Pink
Appearance – Part B White
Cure Room temperature cure or Heat cure
Application Thermal management,
TIM (Thermal Interface Material)
Mix Ratio by weight: Part A: Part B 1 : 1
Mix Ratio by volume: Part A: Part B 1 : 1
Solids Content, % 100
Operating Temperature Range -60 to 200ºC

FEATURES AND BENEFITS

● Thermal Conductivity: 2.0 W/m-K
● Ultra-conforming, designed for fragile and low-stress applications
● Ambient and accelerated cure schedules
● 100% solids – no cure by-products
● Excellent low and high temperature mechanical and chemical stability

BERGQUIST GAP FILLER TGF 2000 is a high performance, thermally conductive, liquid gap filling material supplied as a two-component, room or elevated temperature curing system. The material provides a balance of cured material properties and good compression set (memory). The result is a soft, thermally conductive, form-in-place elastomer ideal for coupling “hot” electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, BERGQUIST GAP FILLER TGF 2000 flows under pressure like a grease. After cure, it does not pump from the interface as a result of thermal cycling and is dry to the touch.

TYPICAL APPLICATIONS
● Automotive electronics (HEV, NEV, batteries)
● Telecommunications
● Computer and peripherals
● Thermally conductive vibration dampening
● Between any heat-generating semiconductor and a heat
sink

Typical Properties

TYPICAL PROPERTIES OF UNCURED MATERIAL 

Spindle TF, speed 20 rpm 

300,000 

Density, ASTM D792, g/cc 

2.9 

Pot Life @ 25ºC , time for viscosity to double 

@ 15 minutes 

@ 60 minutes  

@ 600 minutes 

Shelf Life @ 25ºC , days 

180  

TYPICAL CURE SCHEDULE 

Cure Schedule 

1 to 2 hours @ 25°C 

5 minutes @ 100°C 

Alternative Cure Schedule 1 

3 to 4 hours @ 25°C 

15 minutes @ 100°C 

Alternative Cure Schedule 2 

3 days @ 25°C 

1 hour @ 100°C 

Rheometer – time to read 90% cure. 

 

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties  
Hardness, Shore 00, Thirty second delay value, ASTM D2240 70
Heat Capacity, ASTM E1269, J/g-K 1.0
Flammability, UL 94 V-0
Electrical Properties  
Dielectric Strength, ASTM D149, V/mil 500
Dielectric Constant , ASTM D150 @ 1,000 Hz 7.0
Volume Resistivity, ASTM D257, ohm-cm 1×10^
Thermal Properties  
Thermal Conductivity, ASTM D5470, W/(m-K)  2.0

 

Resources

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