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BERGQUIST® GAP PAD® TGP 1000VOUS

  • Product code: TGP 1000VOUS
  • Manufacturer: Henkel
  • Package size:
  • Shelf Life: 6 months

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Ultra-Conformable, Thermally Conductive Material for Filling Air Gaps

BERGQUIST GAP PAD TGP 1000VOUS is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature
of the material also gives excellent low stress vibration dampening and shock absorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUS is an
electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high voltage, bare-leaded devices.

FEATURES:

  • Thermal conductivity: 1.0 W/m-K
  • Highly conformable, low hardness
  • “Gel-like” modulus
  • Decreased strain
  • Puncture-, shear- and tear-resistant
  • Electrically isolating

APPLICATIONS:

  • Telecommunications
  • Computers and peripherals
  • Power conversion
  • Between heat-generating semiconductors or magnetic components and a heat sink
  • Areas where heat needs to be transferred to a frame, chassis, or other type of heat spreader

 

 

PROPERTY   IMPERIAL VALUEMETRIC VALUETEST METHOD
ColorMauve/PinkMauve/PinkVisual
Reinforcement CarrierFiberglassFiberglass—
Thickness (in.) / (mm)0.020 to 0.250 0.508 to 6.350 ASTM D374
Inherent Surface Tack (1-sided)11—
Density, Bulk, Rubber (g/cc)1.61.6ASTM D792
Heat Capacity ( J/g-K)1.01.0ASTM E1269
Hardness, Bulk Rubber (Shore 00)55ASTM D2240
Young’s Modulus (psi) / (kPa)8  55ASTM D575
Continuous Use Temp. (°F) / (°C)76 to 392 -60 to 200—
Dielectric Breakdown Voltage (VAC)6,0006,000ASTM D149
Dielectric Constant (1,000 Hz)5.55.5ASTM D150
Volume Resistivity (Ω-m)10^1110^11ASTM D257
Flame RatingV-OV-OUL 94
Thermal Conductivity (W/m-K)1.01.0ASTM D5470

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