BERGQUIST® GAP PAD® TGP 1350 is a highly compliant GAP PAD® material that is ideal for fragile component leads. The material includes a PEN film, which
facilitates rework and improves puncture resistance and handling characteristics. The tacky side of BERGQUIST® GAP PAD® TGP 1350 maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or  uneven topography. BERGQUIST® GAP
PAD® TGP 1350 has inherent tack on one side of the material, eliminating the need for thermally impeding adhesive layers. It is highly recommended that the PEN film be left intact. However, film removal will not have a significant impact on thermal performance. 

FEATURES:

• Thermal conductivity: 1.3 W/m-K (bulk rubber)
• PEN film reinforcement allows easy rework and provides puncture and tear resistance
• Highly conformable/low hardness
• Low strain on fragile components

APPLICATIONS:

• Lighting and LED applications
• When low strain is required for fragile component leads
• Computers and peripherals
• Telecommunications
• Between any heat-generating semiconductor and a heat sink