Home > Products > By Manufacturer > Henkel > BERGQUIST® GAP PAD® TGP 1500R

BERGQUIST® GAP PAD® TGP 1500R

  • Product code: TGP 1500R
  • Manufacturer: Henkel
  • Package size:
  • Shelf Life: 6 month

Request Quote Request Sample

BERGQUIST® GAP PAD® TGP 1500R has the same highly conformable, low-modulus polymer as the standard BERGQUIST® GAP PAD® TGP 1500. The
fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance. The natural tack on both sides of the material allows for
good compliance to mating surfaces of components, further reducing thermal resistance.

FEATURES:

  • Thermal conductivity: 1.5 W/m-K
  • Fiberglass-reinforced for puncture, shear and tear resistance
  • Easy release construction
  • Electrically isolating

APPLICATIONS:

  • Telecommunications
  • Computers and peripherals
  • Power conversion
  • Memory modules / chip scale packages
  • Areas where heat needs to be transferred to a frame chassis or other type of heat spreader
PROPERTY    IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Black Black Visual
Reinforcement Carrier Fiberglass Fiberglass —
Thickness (in.) / (mm) 0.010 to 0.020 0.254 to 0.508  ASTM D374
Inherent Surface Tack (1-sided) 2 2 —
Density, Bulk, Rubber (g/cc) 2.1 2.1 ASTM D792
Heat Capacity ( J/g-K) 1.3 1.3 ASTM E1269
Hardness, Bulk Rubber (Shore 00) 40 40 ASTM D2240
Young’s Modulus (psi) / (kPa) 45 310 ASTM D575
Continuous Use Temp. (°F) / (°C) -76 to 392 -60 to 200 —
Dielectric Breakdown Voltage (VAC) > 6,000 > 6,000 ASTM D149
Dielectric Constant (1,000 Hz) 6.0 6.0 ASTM D150
Volume Resistivity (Ω-m) 10^11 10^11 ASTM D257
Flame Rating V-O V-O UL 94
Thermal Conductivity (W/m-K) 1.5 1.5 ASTM D5470

TDS:Download

Get MSDS

    Please leave your information and we'll get back to you shortly!







    How to bond Hard-to-bond Substrates (Nylon, COC/COP and PEBA) in Medical Devices Assembly? 
    https://prostech.ph/how-to-bond-hard-to-bond-substrates-nylon-coc-cop-and-peba-in-medical-devices-assembly/

    Understanding the Low Surface Energy (LSE) MaterialsNylon in Medical Devices AssemblyCOC/COP (Cyclic Olefin Polymers and Copolymers) in Medical Devices AssemblyBonding
    FIPG & CIPG – A Comprehensive Guide
    https://prostech.ph/fipg-cipg-a-comprehensive-guide/

    1. Overview of Gasket – FIPG and CIPG 2. Key Features and Applications of Each Type1. FIPG – FORMED IN PLACE
    The differences between Silicone-based and Non-silicone Thermal Interface Materials (TIMs)?
    https://prostech.ph/the-differences-between-silicone-based-and-non-silicone-thermal-interface-materials-tims/

    1. Thermal interface materials – TIMs2. Silicone-based or Non-silicone TIMs2.1. Silicone-based thermal interface materials 2.2. Non-silicone thermal interface materials 3. Conclusion In
    tesa® 4928
    https://prostech.ph/tesa-4928/

    tesa® 4928 is a transparent double-sided self-adhesive tape consisting of a PET backing and a modified acrylic adhesive. Features An