BERGQUIST® GAP PAD® TGP 2000 is recommended for low-stress applications that require a mid- to high-thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances.
BERGQUIST® GAP PAD® TGP 2000 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly. The material is supplied with protective liners on both sides. The top side has reduced tack for ease of handling.

FEATURES:

Thermal conductivity: 2.0 W/m-K
Low “S-Class” thermal resistance at very low pressures
Highly conformable, low hardness
Designed for low-stress applications
Fiberglass-reinforced for puncture, shear and tear resistance

APPLICATIONS:

Power electronics DC/DC: 1/4, 1/2, full bricks, etc.
Mass storage devices
Graphics cards, processors and ASICs
Wireline/wireless communications hardware
Automotive engine and transmission controls

Typical Properties

PROPERTY	IMPERIAL VALUE	METRIC VALUE	TEST METHOD
Color	Grey	Grey	Visual
Reinforcement Carrier	Fiberglass	Fiberglass	—
Thickness (in.) / (mm)	0.020 to 0.125	0.508 to 3.175	ASTM D374
Inherent Surface Tack (1-sided)	2	2	—
Density, Bulk, Rubber (g/cc)	2.9	2.9	ASTM D792
Heat Capacity ( J/g-K)	0.6	0.6	ASTM E1269
Hardness, Bulk Rubber (Shore 00)	40	40	ASTM D2240
Young’s Modulus (psi) / (kPa)	45	310	ASTM D575
Continuous Use Temp. (°F) / (°C)	-76 to 392	-60 to 200	—
Dielectric Breakdown Voltage (VAC)	4,000	4,000	ASTM D149
Dielectric Constant (1,000 Hz)	6.0	6.0	ASTM D150
Volume Resistivity (Ω-m)	10^11	10^11	ASTM D257
Flame Rating	V-O	V-O	UL 94
Thermal Conductivity (W/m-K)	2.0	2.0	ASTM D5470

Resources

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