BERGQUIST® GAP PAD® TGP 2000SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stack-up tolerances. BERGQUIST® GAP PAD® TGP 2000SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides. BERGQUIST® GAP PAD® TGP 2000SF is supplied with reduced tack on one side, allowing for burn-in processes and easy rework.
FEATURES:
- Thermal conductivity: 2.0 W/m-K
- Silicone-free formulation
- Medium compliance with easy handling
- Electrically isolating
APPLICATIONS:
- Digital disk drives
- Proximity near electrical contacts (e.g., DC brush motors, connectors, relays)
- Fiber optics modules
| PROPERTY | IMPERIAL VALUE | METRIC VALUE | TEST METHOD |
| Color | Green | Green | Visual |
| Reinforcement Carrier | Fiberglass | Fiberglass | — |
| Thickness (in.) / (mm) | 0.010 to 0.125 | 0.254 to 3.175 | ASTM D374 |
| Inherent Surface Tack (1-sided) | 2 | 2 | — |
| Density, Bulk, Rubber (g/cc) | 2.8 | 2.8 | ASTM D792 |
| Heat Capacity ( J/g-K) | 1.0 | 1.0 | ASTM E1269 |
| Hardness, Bulk Rubber (Shore 00) | 70 | 70 | ASTM D2240 |
| Young’s Modulus (psi) / (kPa) | 33 | 228 | ASTM D575 |
| Continuous Use Temp. (°F) / (°C) | 76 to 257 | -60 to 125 | — |
| Dielectric Breakdown Voltage (VAC) | > 5,000 | > 5,000 | ASTM D149 |
| Dielectric Constant (1,000 Hz) | 6.0 | 6.0 | ASTM D150 |
| Volume Resistivity (Ω-m) | 10^8 | 10^8 | ASTM D257 |
| Flame Rating | V-O | V-O | UL 94 |
| Thermal Conductivity (W/m-K) | 2.0 | 2.0 | ASTM D5470 |
