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BERGQUIST® GAP PAD® TGP 2000SF

  • Product code: TGP 2000SF
  • Manufacturer: Henkel
  • Package size: 0.254 to 3.175mm
  • Shelf Life: 6 months

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BERGQUIST® GAP PAD® TGP 2000SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stack-up tolerances. BERGQUIST® GAP PAD® TGP 2000SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides. BERGQUIST® GAP PAD® TGP 2000SF is supplied with reduced tack on one side, allowing for burn-in processes and easy rework.

FEATURES:

  • Thermal conductivity: 2.0 W/m-K
  • Silicone-free formulation
  • Medium compliance with easy handling
  • Electrically isolating

APPLICATIONS:

  • Digital disk drives
  • Proximity near electrical contacts (e.g., DC brush motors, connectors, relays)
  • Fiber optics modules
PROPERTY    IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Green Green Visual
Reinforcement Carrier Fiberglass Fiberglass —
Thickness (in.) / (mm) 0.010 to 0.125 0.254 to 3.175  ASTM D374
Inherent Surface Tack (1-sided) 2 2 —
Density, Bulk, Rubber (g/cc) 2.8 2.8 ASTM D792
Heat Capacity ( J/g-K) 1.0 1.0 ASTM E1269
Hardness, Bulk Rubber (Shore 00) 70 70 ASTM D2240
Young’s Modulus (psi) / (kPa) 33 228 ASTM D575
Continuous Use Temp. (°F) / (°C) 76 to 257 -60 to 125 —
Dielectric Breakdown Voltage (VAC) > 5,000 > 5,000 ASTM D149
Dielectric Constant (1,000 Hz) 6.0 6.0 ASTM D150
Volume Resistivity (Ω-m) 10^8 10^8 ASTM D257
Flame Rating V-O V-O UL 94
Thermal Conductivity (W/m-K) 2.0 2.0 ASTM D5470

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