BERGQUIST® GAP PAD® TGP 3004SF is a high-performance, 3.0 W/m-K, thermally conductive gap filling material. BERGQUIST® GAP PAD® TGP 3004SF
is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. It is designed for applications that are silicone-sensitive.
BERGQUIST® GAP PAD® TGP 3004SF is constructed using a 0.25-mils PET film that provides a no tack surface on one side and natural tack on the other side.
FEATURES:
- Thermal Conductivity: 3.0 W/m-K
- Silicone-free formulation
- 0.25-mil PET provides easy disassembly, leaving no residue
- Tacky side allows for ease of handling and placement
APPLICATIONS:
- Hard disk drives
- HDD case to tray
- HDD/SSD combination drives
- Automotive electronics
- Medical devices
- Solar energy
- Optical components
- LED lighting
- Laser optics
PROPERTY | IMPERIAL VALUE | METRIC VALUE | TEST METHOD |
Color | Light Gray | Light Gray | Visual |
Reinforcement Carrier | 0.25-mil PET Film | 0.25-mil PET Film | — |
Thickness (in.) / (mm) | 0.010 to 0.125 | 0.254 to 3.175 | ASTM D374 |
Inherent Surface Tack (1-sided) | 1 | 1 | — |
Density, Bulk, Rubber (g/cc) | 3.2 | 3.2 | ASTM D792 |
Continuous Use Temp. (°F) / (°C) | -40 to 257 | -40 to 125 | ASTM E1269 |
Dielectric Constant (1,000 Hz) | 80 | 80 | ASTM D2240 |
Volume Resistivity (Ω-m) | 10^11 | 10^11 | ASTM D575 |
Flame Rating | V-O | V-O | UL 94 |
Thermal Conductivity (W/m-K) | 2.6 | 2.6 | ASTM D5470 |