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BERGQUIST® GAP PAD® TGP 3004SF

  • Product code: TGP 3004SF
  • Manufacturer: Henkel
  • Package size: 0.254 to 3.175mm
  • Shelf Life: 6 months

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BERGQUIST® GAP PAD® TGP 3004SF is a high-performance, 3.0 W/m-K, thermally conductive gap filling material. BERGQUIST® GAP PAD® TGP 3004SF
is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. It is designed for applications that are silicone-sensitive.
BERGQUIST® GAP PAD® TGP 3004SF is constructed using a 0.25-mils PET film that provides a no tack surface on one side and natural tack on the other side.

FEATURES:

  • Thermal Conductivity: 3.0 W/m-K
  • Silicone-free formulation
  • 0.25-mil PET provides easy disassembly, leaving no residue
  • Tacky side allows for ease of handling and placement

APPLICATIONS:

  • Hard disk drives
  • HDD case to tray
  • HDD/SSD combination drives
  • Automotive electronics
  • Medical devices
  • Solar energy
  • Optical components
  • LED lighting 
  • Laser optics

 

PROPERTY   IMPERIAL VALUEMETRIC VALUETEST METHOD
ColorLight GrayLight GrayVisual
Reinforcement Carrier0.25-mil PET Film0.25-mil PET Film—
Thickness (in.) / (mm)0.010 to 0.1250.254 to 3.175 ASTM D374
Inherent Surface Tack (1-sided)11—
Density, Bulk, Rubber (g/cc)3.23.2ASTM D792
Continuous Use Temp. (°F) / (°C)-40 to 257-40 to 125ASTM E1269
Dielectric Constant (1,000 Hz)8080ASTM D2240
Volume Resistivity (Ω-m)10^1110^11ASTM D575
Flame RatingV-OV-OUL 94
Thermal Conductivity (W/m-K)2.62.6ASTM D5470

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