BERGQUIST® GAP PAD® TGP 3004SF is a high-performance, 3.0 W/m-K, thermally conductive gap filling material. BERGQUIST® GAP PAD® TGP 3004SF
is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. It is designed for applications that are silicone-sensitive.
BERGQUIST® GAP PAD® TGP 3004SF is constructed using a 0.25-mils PET film that provides a no tack surface on one side and natural tack on the other side.

FEATURES:

Thermal Conductivity: 3.0 W/m-K
Silicone-free formulation
0.25-mil PET provides easy disassembly, leaving no residue
Tacky side allows for ease of handling and placement

APPLICATIONS:

Hard disk drives
HDD case to tray
HDD/SSD combination drives
Automotive electronics
Medical devices
Solar energy
Optical components
LED lighting
Laser optics

Typical Properties

PROPERTY	IMPERIAL VALUE	METRIC VALUE	TEST METHOD
Color	Light Gray	Light Gray	Visual
Reinforcement Carrier	0.25-mil PET Film	0.25-mil PET Film	—
Thickness (in.) / (mm)	0.010 to 0.125	0.254 to 3.175	ASTM D374
Inherent Surface Tack (1-sided)	1	1	—
Density, Bulk, Rubber (g/cc)	3.2	3.2	ASTM D792
Continuous Use Temp. (°F) / (°C)	-40 to 257	-40 to 125	ASTM E1269
Dielectric Constant (1,000 Hz)	80	80	ASTM D2240
Volume Resistivity (Ω-m)	10^11	10^11	ASTM D575
Flame Rating	V-O	V-O	UL 94
Thermal Conductivity (W/m-K)	2.6	2.6	ASTM D5470

Resources

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