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BERGQUIST® GAP PAD® TGP 800VOS

  • Product code: TGP 800VOS
  • Manufacturer: Henkel
  • Package size:
  • Shelf Life: 6 month

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BERGQUIST GAP PAD TGP 800VOS is recommended for applications that require a minimum amount of pressure on components. BERGQUIST GAP PAD
TGP 800VOS is a highly conformable, low-modulus, filled-silicone polymer on a rubber-coated fiberglass carrier. The material can be used as an interface where one side is in contact with a leaded device.

FEATURES:

  • Thermal conductivity: 0.8 W/m-K
  • Conformable, low hardness
  • Enhanced puncture, shear and tear resistance
  • Electrically isolating

APPLICATIONS:

  • Telecommunications
  • Computers and peripherals
  • Power conversion
  • Between heat-generating semiconductors or magnetic components and a heat sink
  • Areas where heat needs to be transferred to a frame, chassis, or other type of heat spreader

 

PROPERTY    IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Mauve/Pink Mauve/Pink Visual
Reinforcement Carrier Fiberglass Fiberglass —
Thickness (in.) / (mm) 0.020 to 0.200   0.508 to 5.080 ASTM D374
Inherent Surface Tack (1-sided) 1 1 —
Density, Bulk, Rubber (g/cc) 1.6 1.6 ASTM D792
Heat Capacity ( J/g-K) 1.0 1.0 ASTM E1269
Hardness, Bulk Rubber (Shore 00) 25 25 ASTM D2240
Young’s Modulus (psi) / (kPa) 40  275 ASTM D575
Continuous Use Temp. (°F) / (°C) -76 to 392 -60 to 200 —
Dielectric Breakdown Voltage (VAC) > 6,000 > 6,000 ASTM D149
Dielectric Constant (1,000 Hz) 5.5 5.5 ASTM D150
Volume Resistivity (Ω-m) 10^11 10^11 ASTM D257
Flame Rating V-O V-O UL 94
Thermal Conductivity (W/m-K) 0.8 0.8 ASTM D5470

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