BERGQUIST® GAP PAD® TGP A2000 acts as a thermal interface and electrical insulator between electronic components and heat sinks. In the thickness range of
10 to 40 mils, BERGQUIST® GAP PAD® TGP A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces
of components. The 40 mils material thickness is supplied with lower tack on one side, allowing for burn-in processes and easy rework.
FEATURES:
- Thermal conductivity: 2.0 W/m-K
- Fiberglass-reinforced for puncture, shear and tear resistance
- Electrically isolating
APPLICATIONS:
- Computers and peripherals; between CPU and heat spreader
- Telecommunications
- Heat pipe assemblies
- Memory modules
- CD-ROM and DVD cooling
- Areas where heat needs to be transferred to a frame chassis or other type of heat spreader
- DDR SDRAM memory modules
| PROPERTY | IMPERIAL VALUE | METRIC VALUE | TEST METHOD |
| Color | Grey | Grey | Visual |
| Reinforcement Carrier | Fiberglass | Fiberglass | — |
| Thickness (in.) / (mm) | 0.010 to 0.040 | 0.254 to 1.016 | ASTM D374 |
| Inherent Surface Tack (1-sided) | 2 | 2 | — |
| Density, Bulk, Rubber (g/cc) | 2.9 | 2.9 | ASTM D792 |
| Heat Capacity ( J/g-K) | 1.0 | 1.0 | ASTM E1269 |
| Hardness, Bulk Rubber (Shore 00) | 80 | 80 | ASTM D2240 |
| Young’s Modulus (psi) / (kPa) | 55 | 379 | ASTM D575 |
| Continuous Use Temp. (°F) / (°C) | -76 to 392 | -60 to 200 | — |
| Dielectric Breakdown Voltage (VAC) | 4,000 | 4,000 | ASTM D149 |
| Dielectric Constant (1,000 Hz) | 6.0 | 6.0 | ASTM D150 |
| Volume Resistivity (Ω-m) | 10^11 | 10^11 | ASTM D257 |
| Flame Rating | V-O | V-O | UL 94 |
| Thermal Conductivity (W/m-K) | 2.0 | 2.0 | ASTM D5470 |
