BERGQUIST® GAP PAD® TGP HC1000 is an extremely conformable, lowmodulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. BERGQUIST® GAP PAD® TGP HC1000 is offered with removable protective liners on both sides of the material.

FEATURES:

Thermal conductivity: 1.0 W/m-K
Highly conformable, low hardness
“Gel-like” modulus
Fiberglass-reinforced for puncture, shear and tear resistance

APPLICATIONS:

Computers and peripherals
Telecommunications
Heat interfaces to frames, chassis, or other heat spreading devices
Memory modules and chip scale packages
CD-ROM and DVD cooling
Areas where irregular surfaces need to make a thermal interface to a heat sink
DDR SDRAM memory modules
FB-DIMM modules

Typical Properties

PROPERTY	IMPERIAL VALUE	METRIC VALUE	TEST METHOD
Color	Grey	Grey	Visual
Reinforcement Carrier	Fiberglass	Fiberglass	—
Thickness (in.) / (mm)	0.010 to 0.020	0.010 to 0.020	ASTM D374
Inherent Surface Tack (1-sided)	2	2	—
Density, Bulk, Rubber (g/cc)	1.6	1.6	ASTM D792
Heat Capacity ( J/g-K)	1.0	1.0	ASTM E1269
Hardness, Bulk Rubber (Shore 00)	25	25	ASTM D2240
Young’s Modulus (psi) / (kPa)	40	275	ASTM D575
Continuous Use Temp. (°F) / (°C)	-76 to 392	-60 to 200	—
Dielectric Breakdown Voltage (VAC)	> 5,000	> 5,000	ASTM D149
Dielectric Constant (1,000 Hz)	5.5	5.5	ASTM D150
Volume Resistivity (Ω-m)	10^11	10^11	ASTM D257
Flame Rating	V-O	V-O	UL 94
Thermal Conductivity (W/m-K)	1.0	1.0	ASTM D5470

Resources

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