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BERGQUIST® GAP PAD® TGP HC1000

  • Product code: TGP HC1000
  • Manufacturer: Henkel
  • Package size:
  • Shelf Life: 6 months

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BERGQUIST® GAP PAD® TGP HC1000 is an extremely conformable, lowmodulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. BERGQUIST® GAP PAD® TGP HC1000 is offered with removable protective liners on both sides of the material.

FEATURES:

  • Thermal conductivity: 1.0 W/m-K
  • Highly conformable, low hardness
  • “Gel-like” modulus
  • Fiberglass-reinforced for puncture, shear and tear resistance

APPLICATIONS:

  • Computers and peripherals
  • Telecommunications
  • Heat interfaces to frames, chassis, or other heat spreading devices
  • Memory modules and chip scale packages
  • CD-ROM and DVD cooling
  • Areas where irregular surfaces need to make a thermal interface to a heat sink
  • DDR SDRAM memory modules
  • FB-DIMM modules
PROPERTY    IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Grey Grey Visual
Reinforcement Carrier Fiberglass Fiberglass —
Thickness (in.) / (mm) 0.010 to 0.020 0.010 to 0.020  ASTM D374
Inherent Surface Tack (1-sided) 2 2 —
Density, Bulk, Rubber (g/cc) 1.6 1.6 ASTM D792
Heat Capacity ( J/g-K) 1.0 1.0 ASTM E1269
Hardness, Bulk Rubber (Shore 00) 25 25 ASTM D2240
Young’s Modulus (psi) / (kPa) 40 275 ASTM D575
Continuous Use Temp. (°F) / (°C) -76 to 392 -60 to 200 —
Dielectric Breakdown Voltage (VAC) > 5,000 > 5,000 ASTM D149
Dielectric Constant (1,000 Hz) 5.5 5.5 ASTM D150
Volume Resistivity (Ω-m) 10^11 10^11 ASTM D257
Flame Rating V-O V-O UL 94
Thermal Conductivity (W/m-K) 1.0 1.0 ASTM D5470

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