BERGQUIST® GAP PAD® TGP HC1000 is an extremely conformable, lowmodulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. BERGQUIST® GAP PAD® TGP HC1000 is offered with removable protective liners on both sides of the material.
FEATURES:
- Thermal conductivity: 1.0 W/m-K
- Highly conformable, low hardness
- “Gel-like” modulus
- Fiberglass-reinforced for puncture, shear and tear resistance
APPLICATIONS:
- Computers and peripherals
- Telecommunications
- Heat interfaces to frames, chassis, or other heat spreading devices
- Memory modules and chip scale packages
- CD-ROM and DVD cooling
- Areas where irregular surfaces need to make a thermal interface to a heat sink
- DDR SDRAM memory modules
- FB-DIMM modules
| PROPERTY | IMPERIAL VALUE | METRIC VALUE | TEST METHOD |
| Color | Grey | Grey | Visual |
| Reinforcement Carrier | Fiberglass | Fiberglass | — |
| Thickness (in.) / (mm) | 0.010 to 0.020 | 0.010 to 0.020 | ASTM D374 |
| Inherent Surface Tack (1-sided) | 2 | 2 | — |
| Density, Bulk, Rubber (g/cc) | 1.6 | 1.6 | ASTM D792 |
| Heat Capacity ( J/g-K) | 1.0 | 1.0 | ASTM E1269 |
| Hardness, Bulk Rubber (Shore 00) | 25 | 25 | ASTM D2240 |
| Young’s Modulus (psi) / (kPa) | 40 | 275 | ASTM D575 |
| Continuous Use Temp. (°F) / (°C) | -76 to 392 | -60 to 200 | — |
| Dielectric Breakdown Voltage (VAC) | > 5,000 | > 5,000 | ASTM D149 |
| Dielectric Constant (1,000 Hz) | 5.5 | 5.5 | ASTM D150 |
| Volume Resistivity (Ω-m) | 10^11 | 10^11 | ASTM D257 |
| Flame Rating | V-O | V-O | UL 94 |
| Thermal Conductivity (W/m-K) | 1.0 | 1.0 | ASTM D5470 |
