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BERGQUIST GAP PAD TGP HC5000

  • Product code: TGP HC5000
  • Manufacturer: Henkel
  • Package size:
  • Shelf Life: 6 months

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BERGQUIST® GAP PAD® TGP HC5000 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.
BERGQUIST® GAP PAD® TGP HC5000 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. BERGQUIST® GAP PAD® TGP HC5000 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. BERGQUIST® GAP PAD® TGP HC5000 is supplied with protective liners on both sides.

FEATURES:

  • Thermal conductivity: 5.0 W/m-K
  • High-compliance, low compression stress
  • Fiberglass reinforced for shear and tear resistance

APPLICATIONS:

  • Telecommunications
  • ASICs and DSPs
  • Consumer electronics
  • Thermal modules to heat sinks

 

PROPERTY    IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Green Green Visual
Reinforcement Carrier Fiberglass Fiberglass —
Thickness (in.) / (mm) 0.010 to 0.125 0.254 to 3.175  ASTM D374
Inherent Surface Tack (1-sided) 2 2 —
Density, Bulk, Rubber (g/cc) 2.0 2.0 ASTM D792
Heat Capacity ( J/g-K) 1.1 1.1 ASTM E1269
Hardness, Bulk Rubber (Shore 00) 40 40 ASTM D2240
Young’s Modulus (psi) / (kPa) 34 34 ASTM D575
Continuous Use Temp. (°F) / (°C) 76 to 257 -60 to 125 —
Dielectric Breakdown Voltage (VAC) > 6,000 > 6,000 ASTM D149
Dielectric Constant (1,000 Hz) 5.0 5.0 ASTM D150
Volume Resistivity (Ω-m) 10^11 10^11 ASTM D257
Flame Rating V-O V-O UL 94
Thermal Conductivity (W/m-K) 0.9 0.9 ASTM D5470

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