BERGQUIST® GAP PAD® TGP HC5000 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.
BERGQUIST® GAP PAD® TGP HC5000 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. BERGQUIST® GAP PAD® TGP HC5000 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. BERGQUIST® GAP PAD® TGP HC5000 is supplied with protective liners on both sides.
FEATURES:
- Thermal conductivity: 5.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
APPLICATIONS:
- Telecommunications
- ASICs and DSPs
- Consumer electronics
- Thermal modules to heat sinks
| PROPERTY | IMPERIAL VALUE | METRIC VALUE | TEST METHOD |
| Color | Green | Green | Visual |
| Reinforcement Carrier | Fiberglass | Fiberglass | — |
| Thickness (in.) / (mm) | 0.010 to 0.125 | 0.254 to 3.175 | ASTM D374 |
| Inherent Surface Tack (1-sided) | 2 | 2 | — |
| Density, Bulk, Rubber (g/cc) | 2.0 | 2.0 | ASTM D792 |
| Heat Capacity ( J/g-K) | 1.1 | 1.1 | ASTM E1269 |
| Hardness, Bulk Rubber (Shore 00) | 40 | 40 | ASTM D2240 |
| Young’s Modulus (psi) / (kPa) | 34 | 34 | ASTM D575 |
| Continuous Use Temp. (°F) / (°C) | 76 to 257 | -60 to 125 | — |
| Dielectric Breakdown Voltage (VAC) | > 6,000 | > 6,000 | ASTM D149 |
| Dielectric Constant (1,000 Hz) | 5.0 | 5.0 | ASTM D150 |
| Volume Resistivity (Ω-m) | 10^11 | 10^11 | ASTM D257 |
| Flame Rating | V-O | V-O | UL 94 |
| Thermal Conductivity (W/m-K) | 0.9 | 0.9 | ASTM D5470 |
