BERGQUIST® GAP PAD® TGP HC5000

Highly Conformable, Thermally Conductive, Low-Modulus Material

BERGQUIST GAP PAD TGP HC5000 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly. BERGQUIST GAP PAD TGP HC5000 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. BERGQUIST GAP PAD TGP HC5000 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. BERGQUIST GAP PAD TGP HC5000 is supplied with protective liners on both sides.

FEATURES:

• Thermal conductivity: 5.0 W/m-K
• High-compliance, low compression stress
• Fiberglass reinforced for shear and tear resistance

APPLICATIONS:

• Telecommunications
• ASICs and DSPs
• Consumer electronics
• Thermal modules to heat sinks