BERGQUIST® LIQUI-FORM TLF LF2000 is a high thermal conductivity liquid formable
material designed for demanding applications requiring a balance between dispensability, low component stresses during assembly and ease of rework. BERGQUIST® LIQUI-FORM TLF LF2000
is a highly conformable, shear-thinning material which requires no curing, mixing or refrigeration. Its unique formulation assures excellent thermal performance, low applied stress and reliable long-term
performance.
BERGQUIST® LIQUI-FORM TLF LF2000 is thixotropic and has a natural tack, ensuring it forms around the component and stays in place in the application.
FEATURES:
• Thermal conductivity: 2.0 W/m-K
• Applies very low force on components during assembly
• Low volumetric expansion
• Excellent chemical and mechanical stability even at higher temperatures
• No curing required
• Stable viscosity in storage and in the application
APPLICATIONS:
• Bare die to heat spreader lid
• Filling various gaps between heat-generating devices to heat sinks and housings
• Devices requiring low assembly pressure
• BGA, PGA and PPGA components
Property | Values |
Color | Grey |
Low Shear Viscosity (Pa-s) at 0.01 s-1(1) | 20000 |
High Shear Viscosity (Pa-s) at 300 s-1(2) | 110 |
Outgassing (% Total Mass Loss) | 0.53 |
Density (g/cc | 2.8 |
Continuous Use Temp. (°F) / (°C) | -60 to 200 |
Thermal Conductivity (W/m-K) | 2.0 |