BERGQUIST® LIQUI-FORM TLF LF2000 is a high thermal conductivity liquid formable
material designed for demanding applications requiring a balance between dispensability, low component stresses during assembly and ease of rework. BERGQUIST® LIQUI-FORM TLF LF2000
is a highly conformable, shear-thinning material which requires no curing, mixing or refrigeration. Its unique formulation assures excellent thermal performance, low applied stress and reliable long-term
performance.
BERGQUIST® LIQUI-FORM TLF LF2000 is thixotropic and has a natural tack, ensuring it forms around the component and stays in place in the application.
FEATURES:
• Thermal conductivity: 2.0 W/m-K
• Applies very low force on components during assembly
• Low volumetric expansion
• Excellent chemical and mechanical stability even at higher temperatures
• No curing required
• Stable viscosity in storage and in the application
APPLICATIONS:
• Bare die to heat spreader lid
• Filling various gaps between heat-generating devices to heat sinks and housings
• Devices requiring low assembly pressure
• BGA, PGA and PPGA components
