BERGQUIST® TGR 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer processor and a copper-based heat sink. Other high watt density applications will benefit from the extremely low thermal impedance of BERGQUIST® TGR 4000.
FEATURES:
• Thermal conductivity: 4.0 W/m-K
• Exceptional thermal performance:
0.19°C/W (at 50 psi)
APPLICATIONS:
• High performance computer processors (traditional screw fastening or clamping methods will provide adequate force to optimize the thermal performance of BERGQUIST® TGR 4000)
• High watt density applications where the lowest thermal resistance interface is required
Property | Values |
Color | Grey |
Density (g/cc) | 4.0 |
Continuous Use Temp. (°F) / (°C) | 150 |
Electrical Resistivity (Ω-m)(1) | N/A |
Thermal Conductivity (W/m-K) | 4.0 |