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BERGQUIST® TGR 4000 – Thermal Interface Compound for Copper-Based Heat Sinks

  • Product code: TGR 4000
  • Manufacturer: Henkel
  • Package size:
  • Shelf Life:

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BERGQUIST® TGR 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer processor and a copper-based heat sink. Other high watt density applications will benefit from the extremely low thermal impedance of BERGQUIST® TGR 4000.

FEATURES:

• Thermal conductivity: 4.0 W/m-K
• Exceptional thermal performance:
0.19°C/W (at 50 psi)

APPLICATIONS:

• High performance computer processors (traditional screw fastening or clamping methods will provide adequate force to optimize the thermal performance of BERGQUIST® TGR 4000)
• High watt density applications where the lowest thermal resistance interface is required

 

Property Values 
Color Grey
Density (g/cc) 4.0
Continuous Use Temp. (°F) / (°C) 150
Electrical Resistivity (Ω-m)(1) N/A
Thermal Conductivity (W/m-K) 4.0

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