70-08A AP
Bostik 70-08A AP is a high-quality Silyl Modified Polymer (SMP) adhesive optimized for windscreen bonding and mobile assembly applications. It provides high initial strength and passes FMVSS 212 standards, delivering quick and secure bonding in OEM and coach-building processes.
70-08A AP Features:
- High green strength for immediate handling
- Primerless adhesion to glass and substrates
- Meets FMVSS 212 automotive glazing requirements
- Solvent-, isocyanate-, and PVC-free
- Low shrinkage and low conductivity
- Neutral, odorless curing
70-08A AP Applications:
- Windscreen bonding
- Mobile units and OEM manufacturing
- General-purpose structural bonding in transportation
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
Need help selecting the right product or solution?
|
TYPICAL PHYSICAL PROPERTIES |
|
|
Description |
Results |
|
Basic material |
Silyl Modified Polymer (SMP) |
|
Curing method |
Moisture |
|
Specific gravity |
ca. 1.5g/ml |
|
Skin forming time |
ca. 15 min. |
|
Open time |
< 15 min. |
|
Curing speed after 24 hrs |
ca. 3 mm |
|
Shore A hardness |
ca. 60 |
|
Volume change |
< 3% |
|
Electrical volume resistivity |
> 10^11 ohm cm |
|
Tensile stress (100%) |
ca. 2.3 MPa |
|
Tensile stress at break |
ca. 2.9 MPa |
|
Elongation at break |
ca. 250% |
|
Shear stress |
ca. 2.4 MPa (Alu-Alu; adh. thickness 2mm, test speed 50 mm/min.) |
|
Tear propagation |
ca. 16N/mm (Type C, test speed 500mm/min.) |
|
E-Modulus (10%) |
ca. 5.5 MPa |
|
Solvent percentage |
0% |
|
Isocyanate percentage |
0% |
|
Temperature resistance |
-40°F to 248°F (-40°C to 120°C) |
|
Temperature resistance |
356°F (180°C) - max. 30 min. |
|
Application temperature |
41°F to 95°F (5°C to 35°C) |
|
UV and weather resistance |
Very good |
|
Colors (standard) |
Black |
|
Packaging |
9.8oz Cartridge, 13.5oz Sausage, 20oz Sausage, 5 Gal Pail, 52 Gal Drum |
