Bostik Born2Bond™ HHD 6006 is a one-component, solvent-free, moisture-curing hot-melt polyurethane adhesive. It reacts with moisture in the environment or substrates, forming a durable, cross-linked thermoset bond for demanding applications.
HHD 6006 Features:
Superior flexibility for adaptable bonding performance.
Excellent adhesion to materials such as glass and metal.
Low-temperature application suitability.
High thermal stability in extreme temperatures.
Precision dispensing for delicate electronics.
Balanced strength and elasticity for durability.
Chemical resistance to various chemicals.
Sweat and sebum resistance for durability in skin contact applications.
HHD 6006 Applications:
Used for electronic device assembly.
Bonds PC, ABS, aluminum, and glass substrates.
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
Technical Added Value to customer Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers. Need help selecting the right product or solution?
