Bostik Born2Bond™ HHD 6009 is a high-performance, one-component, solvent-free, moisture-curing hot-melt polyurethane adhesive. Upon application, it reacts with ambient moisture or the water content in substrates, forming a durable, cross-linked thermoset adhesive that ensures long-lasting bonds for demanding applications.
HHD 6009 Features:
Excellent adhesion to various materials, including glass and metal.
Superior flexibility for strong, adaptable bonding performance.
Low-temperature application suitability.
High thermal stability under extreme conditions.
Precision dispensing ideal for delicate electronic components.
Balanced strength and elasticity for durability and flexibility.
Chemical resistance against various chemicals.
Sweat and sebum resistance for skin contact applications.
HHD 6009 Applications:
Ideal for electronic device assembly.
Bonds substrates like PC, ABS, aluminum, and glass.
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
Technical Added Value to customer Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers. Need help selecting the right product or solution?
